Overview

Atomic Layer Deposition (ALD) is a method of applying thin films to various substrates with atomic scale precision. As chip node dimensions are continuously shrinking, traditional deposition techniques have reached their limits. Depositing ultra-thin layers at the nanoscale requires Atomic Layer Deposition (ALD) technology, which allows materials to be deposited one atomic layer at a time. ALD series diaphragm valves are used to deliver precise doses of gases during the deposition process used to create semiconductor chips.

Features

• Ultrahigh cycle life with high-speed actuation
• Quick response capable of valve opening or closing time of less than 5 ms
• Thermal actuator extends the life in applications where the body is heated
• Contained seat to provide excellent resistance to swelling and contamination
• Elgiloy diaphragm to provide high strength and corrosion resistance to ensure long cycle life
• High-purity grade PFA seat with broad range of chemical compatibility
• Minimum particle generation and dead space facilitate purging
• Valves with inductive sensors, solenoid valve assemblies, heater cartridge and thermocouple holes are available

Technical Data

Application

Suitable for atomic layer deposition (ALD) processes in the following semiconductor fields

• High-K dielectrics and metal gate
• MEMS
• Optoelectronic materials and devices
• Integrated circuit interconnect line diffusion barrier
• Flat panel display (organic light emitting diode material, OLED)
• Optical element
• Solar cell
• Various types of films (<100 nm)

For more information, please contact us directly.